Cascode heterojunction bipolar transistor

ABSTRACT

Fabrication methods and device structures for heterojunction bipolar transistors. A first emitter of a first heterojunction bipolar transistor and a second collector of a second heterojunction bipolar transistor are formed in a device layer of a silicon-on-insulator substrate. A first base layer of a first heterojunction bipolar transistor is epitaxially grown on the device layer with an intrinsic base portion arranged on the first emitter. A first collector of the first heterojunction bipolar transistor is epitaxially grown on the intrinsic base portion of the first base layer. A second base layer of the second heterojunction bipolar transistor is epitaxially grown on the device layer with an intrinsic base portion arranged on the second collector. A second emitter of the second heterojunction bipolar transistor is epitaxially grown on the intrinsic base portion of the second base layer. A connection is formed between the first emitter and the second collector.

BACKGROUND

The invention relates generally to semiconductor device and integratedcircuit fabrication and, in particular, to fabrication methods anddevice structures for heterojunction bipolar transistors.

A bipolar junction transistor is a three-terminal electronic device thatincludes an emitter, an intrinsic base, and a collector in itsconstruction. The intrinsic base is arranged between the emitter andcollector in the structure of the device. In an NPN bipolar junctiontransistor, the emitter and collector may be composed of n-typesemiconductor material, and the intrinsic base may be composed of p-typesemiconductor material. In a PNP bipolar junction transistor, theemitter and collector may be composed of p-type semiconductor material,and the intrinsic base may be composed of n-type semiconductor material.In operation, the base-emitter junction is forward biased, thebase-collector junction is reverse biased, and the collector-emittercurrent may be controlled with the base-emitter voltage.

A heterojunction bipolar transistor is a variant of a bipolar junctiontransistor in which at least two of the collector, emitter, andintrinsic base are constituted by semiconductor materials with differentenergy bandgaps, which creates heterojunctions. For example, thecollector and/or emitter of a heterojunction bipolar transistor may beconstituted by silicon, and the base of a heterojunction bipolartransistor may be constituted by a silicon-germanium (SiGe) alloy, whichis characterized by a narrower band gap than silicon.

Improved fabrication methods and device structures for heterojunctionbipolar transistors are needed.

SUMMARY

In an embodiment of the invention, a structure includes a firstheterojunction bipolar transistor with a first emitter in a device layerof a silicon-on-insulator substrate, a first base layer with anintrinsic base portion arranged on the first emitter, and a firstcollector on the intrinsic base portion of the base layer. The intrinsicbase portion of the first base layer is arranged in a vertical directionbetween the first emitter and the first collector. The structure furtherincludes a second heterojunction bipolar transistor with a secondcollector in the device layer, a second base layer with an intrinsicbase portion arranged on the second collector, and a second emitter onthe intrinsic base portion of the base layer. The intrinsic base portionof the second base layer is arranged in the vertical direction betweenthe second emitter and the second collector. The first emitter iscoupled with the second collector, and the first emitter and the secondcollector each extend vertically in the device layer to a buried oxidelayer of the silicon-on-insulator substrate.

In an embodiment of the invention, a method is provided for fabricatinga structure using a device layer of a silicon-on-insulator substrate.The method includes forming a first emitter of a first heterojunctionbipolar transistor and a second collector of a second heterojunctionbipolar transistor in the device layer. The method further includesepitaxially growing a first base layer of a first heterojunction bipolartransistor on the device layer with an intrinsic base portion arrangedon the first emitter, and epitaxially growing a first collector of thefirst heterojunction bipolar transistor on the intrinsic base portion ofthe first base layer. The method further includes epitaxially growing asecond base layer of the second heterojunction bipolar transistor on thedevice layer with an intrinsic base portion arranged on the secondcollector, and epitaxially growing a second emitter of the secondheterojunction bipolar transistor on the intrinsic base portion of thesecond base layer. The method further includes forming a connectionbetween the first emitter and the second collector.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate various embodiments of theinvention and, together with a general description of the inventiongiven above and the detailed description of the embodiments given below,serve to explain the embodiments of the invention.

FIGS. 1-8 are cross-sectional views of a device structure at successivefabrication stages of a processing method in accordance with embodimentsof the invention.

FIG. 1A is a top view of a device structure at an initial fabricationstage of a processing method and in which the block mask of FIG. 1 isremoved for purposes of clarity of description.

FIG. 4A is a diagrammatic view of the composition of the base layers inthe device structure of FIG. 4.

FIG. 9 is an electrical circuit formed using the device structure ofFIG. 8.

FIG. 10 is a cross-sectional view of a device structure in accordancewith embodiments of the invention.

FIG. 11 is an electrical circuit formed using the device structure ofFIG. 10.

DETAILED DESCRIPTION

With reference to FIGS. 1, 1A and in accordance with embodiments of theinvention, a semiconductor substrate 10 may be asemiconductor-on-insulator (SOI) substrate that includes a device layer12, a buried oxide (BOX) layer 14, and a handle wafer 16. The devicelayer 12 is separated from the handle wafer 16 by the intervening BOXlayer 14 and is considerably thinner than the handle wafer 16. Thedevice layer 12 is located on a top surface of the BOX layer 14 and iselectrically insulated from the handle wafer 16 by the BOX layer 14. TheBOX layer 14 may be comprised of an electrical insulator, such assilicon dioxide (e.g., SiO₂).

A block mask 18 is applied, and the device layer 12 is implanted withenergetic ions, as diagrammatically indicated by the arrows 21, into itstop surface to form doped regions 20, 22, 24. The trajectories of theions penetrate into the semiconductor material of the device layer 12 toprovide a depth profile that extends across the entire thickness of thedevice layer 12. The ions may be generated from a suitable source gasand implanted with selected implantation conditions using an ionimplantation tool. The implantation conditions (e.g., ion species, dose,kinetic energy) may be selected to tune the electrical and physicalcharacteristics (e.g., depth profile) of the doped regions 20, 22, 24.In an embodiment, the ions 21 may deliver a concentration of an n-typedopant from Group V of the Periodic Table (e.g., phosphorus (P) and/orarsenic (As)) that imparts n-type electrical conductivity to theconstituent semiconductor material of the device layer 12.

The block mask 18 may be comprised of a layer of a light-sensitivematerial, such as an organic photoresist, applied by a spin coatingprocess, pre-baked, exposed to light projected through a photomask,baked after exposure, and developed with a chemical developer. The blockmask 18 has a thickness and a stopping power sufficient to block themasked areas of the device layer 12 against receiving a dose of the ions21. The block mask 18 is stripped, as reflected in FIG. 1A, followingthe implantation.

The doped regions 20, 22, 24 may extend vertically over the entirethickness of the device layer 12 to the BOX layer 14 (i.e., theinterface between the device layer 12 and the BOX layer 14). An emitterregion 36 is arranged in the device layer 12 laterally between the dopedregion 20 and the doped region 22. A collector region 38 is arranged inthe device layer 12 laterally between the doped region 22 and the dopedregion 24. The doped region 22 is laterally arranged between the emitterregion 36 and the collector region 38 as a connecting link comprised ofa section of the device layer 12 characterized by a reduced electricalresistivity due to the implantation. The emitter region 36 and thecollector region 38 likewise may extend vertically over the entirethickness of the device layer 12 to the BOX layer 14 (i.e., theinterface between the device layer 12 and the BOX layer 14).

With reference to FIG. 2 in which like reference numerals refer to likefeatures in FIGS. 1, 1A and at a subsequent fabrication stage of theprocessing method, a layer stack that includes non-conductor layers 26,28, 30, 32 is applied on the device layer 12. The layers 26 and 28 maybe composed of dielectric materials with etch selectivity to each other,and are located on a top surface of the device layer 12. Layer 26 may becomposed of a dielectric material, such as silicon dioxide (SiO₂) grownby wet or dry oxidation of the device layer 12 or deposited by chemicalvapor deposition (CVD). Layer 28 is formed on the top surface of thelayer 26, and may be composed of a dielectric material, such as siliconnitride (Si₃N₄) deposited by CVD. Layer 30 may be composed of asemiconductor material, such as polycrystalline silicon (i.e.,polysilicon) deposited by low-pressure chemical vapor deposition(LPCVD), and may include an electrically-active dopant that isintroduced during deposition. In an embodiment, the layer 30 may bedoped with a p-type dopant from Group III of the Periodic Table (e.g.,boron (B)) that imparts p-type electrical conductivity to theconstituent semiconductor material of the layer 30. The layer 32 isformed on the layer 30 and may be composed of a dielectric material,such as silicon dioxide (SiO₂) deposited by CVD

In an alternative embodiment, the emitter region 36 and/or the collectorregion 38 may be doped to elevate the electrical conductivity of theconstituent semiconductor material of the device layer 12. Thesemiconductor material of the emitter region 36 and/or the collectorregion 38, if doped, will have the same conductivity type assemiconductor material of the doped regions 20, 22, 24. For example, ablock mask (not shown) may be applied to mask the doped regions 20, 22,24, and the emitter region 36 and collector region 38 may both beimplanted with ions delivering an n-type dopant from Group V of thePeriodic Table (e.g., phosphorus (P) and/or arsenic (As)). Theimplantation conditions (e.g., ion species, dose, kinetic energy) may beselected to tune the electrical and physical characteristics (e.g.,depth profile) of the emitter region 36 and collector region 38. Forexample, the emitter region 36 may be implanted to adjust the currentgain (i.e., beta) of the associated bipolar junction transistor, and thecollector region 38 may be implanted to adjust the breakdown voltage ofthe associated bipolar junction transistor.

The doped region 20 is separated from the doped region 22 by a spacing,S1. The spacing S1 determines the width of the emitter region 36.Similarly, the doped region 22 is separated from the doped region 24 bya spacing, S2. The spacing S2 determines the width of the collectorregion 38. These spacings may be used to control the bottom junctionsand the properties of the transistors formed using the doped regions 20,22, 24, as discussed herein.

With reference to FIG. 3 in which like reference numerals refer to likefeatures in FIG. 2 and at a subsequent fabrication stage of theprocessing method, an etch mask 40 is formed on the layer 32. The etchmask 40 may be composed of a layer of a light-sensitive material, suchas an organic photoresist, applied by a spin coating process, pre-baked,exposed to light projected through a photomask, baked after exposure,and developed with a chemical developer. Openings 42, 44 may be formedin the layers 28, 30, 32 by one or more etching processes in which eachetching process, which may be a reactive ion etching (RIE) process or awet chemical process, is performed with a single etching step having anetch chemistry or multiple etching steps with different etchchemistries. The etching process extending the openings 42, 44 throughlayer 28 may stop on the layer 26.

The layer 30 is laterally recessed relative to the layers 28 and 32using an isotropic etching process to form lateral extensions 41, 43 ofthe openings 42, 44. An isotropic etching process removes material inmultiple directions (e.g., in lateral and vertical directions). Theisotopic etching process may be either a dry etching process or a wetchemical etching process that etches the material of layer 30 selectiveto the materials of layers 26, 28, and 32. After the openings 42, 44 areformed and the layer 30 is laterally recessed to form the lateralextensions 41, 43, the etch mask 40 may be stripped by, for example,ashing.

With reference to FIG. 4 in which like reference numerals refer to likefeatures in FIG. 3 and at a subsequent fabrication stage of theprocessing method, a single crystal layer stack is formed inside each ofthe openings 42, 44 (FIG. 3), which operate to respectively self-alignthe respective layer stacks with the emitter region 36 and collectorregion 38 in the device layer 12. The layer stack inside opening 42includes a link layer 46, a base layer 48, and a collector layer 50, andthe layer stack inside opening 44 includes a link layer 47, a base layer49, and an emitter layer 51. The link layer 46 is arranged verticallybetween the emitter region 36 and the base layer 48, and the base layer48 is arranged vertically between the link layer 46 and the collectorlayer 50. The link layer 47 is arranged vertically between the collectorregion 38 and the base layer 49, and the base layer 49 is arrangedvertically between the link layer 47 and the emitter layer 51.

The layers 46, 48, 50 inside opening 42 and the layers 47, 49, 51 insideopening 44 may be composed of semiconductor materials formed using anepitaxial growth process, such low temperature epitaxial grown with CVD,and each layer pair in the layer stacks may be concurrently formed by asingle deposition process. The composition of the layer stacks may bemodulated during epitaxial growth to produce the distinct layers 46, 48,50 inside of the opening 42, and the distinct layers 47, 49, 51 insideof the opening 44. For example, base layer 48 and base layer 49constituting one of the layer pairs in the respective layer stacks mayhave identical composition profiles achieved by growth modulation. Thelayer stacks may be formed by a selective epitaxial growth (SEG) processin which semiconductor material nucleates for epitaxial growth onsemiconductor surfaces such as the single crystal semiconductor materialof the device layer 12 in the emitter region 36 and the collector region38, but does not nucleate for epitaxial growth from insulator surfaces,such as the top surface of the layer 32.

The layers 48 and 49 have a different composition than the layers 46, 48and the layers 50, 51. The base layers 48, 49 may be composed ofsingle-crystal silicon-germanium (SiGe) in an alloy containing a peakcontent of germanium (Ge) ranging from 5 atomic percent to 50 atomicpercent and, in the balance, a content of silicon (S1) ranging from 95atomic percent to 50 atomic percent. The composition profile shared bythe layer stacks is diagrammatically shown in FIG. 4A, in which thegermanium (Ge) content is shown by the full line and the dopant (e.g.,boron (B)) content is shown by the dashed line.

Germanium is absent in the composition of the layers 46, 48 in thislayer pair (Ei/Ci) and the layers 50, 51 in this layer pair (Ei/Ci), andthese layer pairs may be composed of silicon (Si). The germanium contentof the base layers 48, 49 at the respective interfaces with link layers46, 47 ramps upward (e.g., linearly increases) from a zero germaniumcontent in layers 46, 47 (i.e., pure silicon) to a given germaniumcontent, is maintained at a given germanium content over the thicknessof the base layers 48, 49, and ramps downward (e.g., linearly decreases)from a given germanium content to a zero germanium content in layers 50,51 (i.e., pure silicon). In the representative embodiment, the givengermanium content over the thickness of the base layers 48, 49 may beconstant at the peak germanium content. The profile for the germaniumcontent is symmetrical within the base layers 48, 49, and has atrapezoidal shape.

The base layer 48 and the base layer 49 may be respectively doped tohave an opposite conductivity type from the emitter region 36 and thecollector region 38, if regions 36, 38 are doped. For example, thesemiconductor material of the base layers 48, 49 may be doped with anelectrically-active dopant, such as a p-type dopant (e.g., boron (B))selected from Group III of the Periodic Table in a concentration that iseffective to impart p-type conductivity. The dopant concentration in thebase layers 48, 49, which is superimposed on the germanium content, isnot uniform across their respective thicknesses. Instead, the dopantconcentration in the base layers 48, 49 may be centralized in a centraldoped region over their layer thicknesses. The central doped region maybe, for example, symmetrically located between the link layer 46 and thecollector layer 50, and between the link layer 47 and the emitter layer51. A partial layer thickness of the base layers 48, 49 is undopedbetween the central doped region and the respective interfaces with linklayers 46, 47 and a partial layer thickness of the base layers 48, 49 isundoped between the central doped region and the respective interfaceswith the collector layer 50 and emitter layer 51. The portions of thebase layers 48, 49 that form in the lateral extensions 41, 43 (FIG. 3)of the openings 42, 44 may furnish extrinsic base regions that are laterused in the process to contact the base layers 48, 49.

With reference to FIG. 5 in which like reference numerals refer to likefeatures in FIG. 4 and at a subsequent fabrication stage of theprocessing method, dielectric layers 52 are respectively formed at thetop surfaces of the collector layer 50 and emitter layer 51. In anembodiment, the dielectric layers 52 may be formed by oxidizing thesemiconductor material constituting the collector layer 50 and emitterlayer 51 with an oxidation process. The collector layer 50 and emitterlayer 51 may both be implanted with ions delivering an n-type dopantfrom Group V of the Periodic Table (e.g., phosphorus (P) and/or arsenic(As)). The implantation conditions (e.g., ion species, dose, kineticenergy) may be selected to provide doped regions 53 that enhance theelectrical conductivity of the collector layer 50 and emitter layer 51at and near their respective top surfaces.

With reference to FIG. 6 in which like reference numerals refer to likefeatures in FIG. 5 and at a subsequent fabrication stage of theprocessing method, spacers 54 are formed adjacent to the collector layer50 and emitter layer 51. In an embodiment, the layer 32 may be removedby, for example, a wet chemical etch using a hot phosphoric acid, and aconformal nitride layer may be applied and anisotropically etched toform the spacers 54. In an alternative embodiment, an etch mask (notshown) may be applied and the layer 32 may be etched by an etchingprocess selective to the dielectric layers 52 to form the spacers 54.The etching process may also remove the material of the layer 32selective to the material of the layer 30. Alternatively, an additionallayer of, for example, silicon dioxide may be formed between layer 30and layer 32 in the layer stack including layers 26, 28, 30, 32 in orderto provide etch selectivity.

With reference to FIG. 7 in which like reference numerals refer to likefeatures in FIG. 6 and at a subsequent fabrication stage of theprocessing method, an etch mask 56 is formed and an etching process isused to etch through the layers 28 and 30. The etching process isselective to the material of the layer 26, which operates as an etchstop. The etch mask 56 may be comprised of a layer of a light-sensitivematerial, such as an organic photoresist, applied by a spin coatingprocess, pre-baked, exposed to light projected through a photomask,baked after exposure, and developed with a chemical developer. The etchmask 56 is stripped following the implantation. The layer 30 isseparated into distinct sections that are associated with a collector-uptransistor 58 and an emitter-up transistor 60. A portion of the dopedregion 24 is exposed between collector-up transistor 58 and emitter-uptransistor 60 following the etching process.

The device structure of the collector-up transistor 58 is aheterojunction bipolar transistor characterized by a verticalarchitecture that includes a collector provided by the collector layer50, an emitter provided by the emitter region 36 arranged in the devicelayer 12, and an intrinsic base provided by the base layer 48 locatedvertically between the emitter region 36 and collector layer 50. Thebase layer 48 adjoins the collector layer 50 along a p-n junction, andthe emitter region 36 adjoins the base layer 48 along another p-njunction. The device structure of the collector-up transistor 58 can bedivided into an intrinsic device region that includes the p-n junctions,and an extrinsic device region outside of the intrinsic device region.In the extrinsic device region, the doped region 20 provides a contactregion coupled with the emitter region 36, and the extrinsic basesection of the base layer 48 provides a contact region coupled with theintrinsic base section of the base layer 48.

The device structure of the emitter-up transistor 60 is a heterojunctionbipolar transistor characterized by a vertical architecture thatincludes an emitter provided by the emitter layer 51, a collectorprovided by the collector region 38 arranged in the device layer 12, andan intrinsic base provided by the base layer 49 located verticallybetween the collector region 38 and the emitter layer 51. The base layer49 adjoins the emitter layer 51 along a p-n junction, and the collectorregion 38 adjoins the base layer 49 along another p-n junction. Thedevice structure of the emitter-up transistor 60 can be divided into anintrinsic device region that includes the p-n junctions, and anextrinsic device region outside of the intrinsic device region. In theextrinsic device region, the doped region 24 provides a contact regioncoupled with the collector region 38, and the extrinsic base section ofthe base layer 49 provides a contact region coupled with the intrinsicbase section of the base layer 49.

The spacing between the doped regions 20, 22 (FIG. 1A) may be adjustedto control the properties of the collector-up transistor 58.Specifically, the spacing may be used to control the base-emittercapacitance and the transistor gain (i.e., beta). In an embodiment, anadditional mask may be used for an ion implantation of the emitterregion 36 in the device layer 12 in order to adjust the doping in theemitter region 36 and control the junction. The spacing between thedoped regions 22, 24 (FIG. 1A) may be adjusted to control the propertiesof the emitter-up transistor 60. Specifically, the spacing may be usedto control the collector-base capacitance and the breakdown voltage. Inan embodiment, an additional mask may be used for an ion implantation ofthe collector region 38 in the device layer 12 in order to adjust thedoping in the collector region 38 and control the junction.

With reference to FIG. 8 in which like reference numerals refer to likefeatures in FIG. 7 and at a subsequent fabrication stage of theprocessing method, sections of a silicide layer 62 are formed at therespective top surfaces of the doped regions 20 and 24, and at therespective top surfaces of the extrinsic base sections of the baselayers 48, 49. A section of the silicide layer 62 is also formed at thetop surface of the portion of the doped region 22 that is exposedbetween the collector-up transistor 58 and the emitter-up transistor 60.The sections of the silicide layer 62 may be simultaneously formed by asilicidation process that involves one or more annealing steps to form asilicide phase by reacting a layer of silicide-forming metal and thesemiconductor material contacting the silicide-forming metal.

The emitter region 36 and the collector region 38 are connected (i.e.,shorted) by the doped region 22 in the device layer 12. The section ofthe silicide layer 62 in the doped region 22 may enhance the electricalconductivity of the connection between the regions 36, 38. Thetransistors 58, 60 are connected in a configuration that is amenable touse in a cascode type circuit, and that may be placed on a single chipthat further includes a transistor-based switch.

Middle-of-line (MOL) processing and back-end-of-line (BEOL) processingfollow, which includes formation of contacts and wiring for a localinterconnect structure, and formation of dielectric layers, via plugs,and wiring for a BEOL interconnect structure coupled by the localinterconnect structure with the collector-up transistor 58 andemitter-up transistor 60.

Contacts 64, 66, 68 may be formed as conductive features of a localinterconnect structure for the collector-up transistor 58 and theemitter-up transistor 60. For the collector-up transistor 58, one ormore contacts 64 are aligned with the contact region provided by thedoped region 20 and with the contact region provided by the doped region24, one or more contacts 66 are aligned with a portion of the base layer48 that is outside of the footprint of the collector layer 50 and itsspacers 54, and one or more contacts 68 are aligned with the collectorlayer 50. For the emitter-up transistor 60, one or more contacts 64 arealigned with the contact region provided by the doped region 24, one ormore contacts 66 are aligned with a portion of the base layer 49 that isoutside of the footprint of the emitter layer 51 and its spacers 54, andone or more contacts 68 are aligned with the emitter layer 51. Each setof one or more contacts 64, 66, 68 may comprise an array of vias thatare arranged with a given pitch.

In an alternative embodiment and as shown in FIG. 10, the contacts 66may only be included on one side or the other of the portion of the baselayer 48 defining the extrinsic base of the collector-up transistor 58.In an alternative embodiment and as also shown in FIG. 10, the contacts66 may only be included on one side or the other of the portion of thebase layer 49 defining the extrinsic base of the emitter-up transistor60.

The contacts 64, 66, 68 are arranged in an interlayer dielectric layer(not shown), which may be composed of silicon dioxide (SiO₂), siliconnitride (Si₃N₄), fluorine-doped silicon dioxide, or a combination ofthese and other dielectric materials. The contacts 64, 66, 68 may becomposed of a conductive material, such as tungsten, deposited inopenings defined in the interlayer dielectric layer by photolithographyand etching processes. The contacts 64, 66, 68 may be connected withadditional conductive features, such as wires (not shown), arranged inthe dielectric layer and composed of a conductive material, such ascopper (Cu).

With reference to FIG. 9 in which like reference numerals refer to likefeatures in FIG. 8, the collector-up transistor 58 and the emitter-uptransistor 60 may be arranged as structural elements in a cascodeamplifier circuit 70. The collector-up transistor 58 (Q2) operates as acommon base source in an output stage of the cascode amplifier circuit70, and the emitter-up transistor 60 (Q1) operates as a common gatesource in an input stage of the cascode amplifier circuit 70. Thecascode amplifier circuit 70 further includes a bias circuit 74 coupledwith the base layer 48 of the collector-up transistor 58, a bias circuit76 coupled with the base layer 49 of the emitter-up transistor 60, andvarious coupling capacitors and inductors. An input signal Vin isdirected into the cascode amplifier circuit 70 at the base layer 48 ofthe collector-up transistor 58 and is output from the cascode amplifiercircuit 70 at the collector region 38 of the emitter-up transistor 60 asan output signal Vout.

With reference to FIGS. 10, 11 and in accordance with alternativeembodiments, a cascode amplifier circuit 72 includes an arrangement inwhich the base layer 48 of the collector-up transistor 58 iselectrically isolated from the base layer 49 of the emitter-uptransistor 60. To that end, an isolation region 80 may be formed thatpenetrates through the doped region 22 in the device layer 12 and theBOX layer 14, and into the handle wafer 16 beneath the BOX layer 14. Theisolation region 80 is formed by etching a trench through the devicelayer 12 and the BOX layer 14 and to a given depth into the handle wafer16, and filling the trench with a dielectric material, such as silicondioxide (SiO₂). A connection 78 may be provided by conductive featuresin the interconnect structure to couple the contact 64 connected withthe base layer 48 with the contact 64 connected with the base layer 49,and permits additional passive circuit elements, such as the inductor inthe cascode amplifier circuit 72, to be connected between the base layer48 of the collector-up transistor 58 and the base layer 49 of theemitter-up transistor 60. The isolation relation is also arrangedbetween the emitter region 36 and the collector region 38, whichnecessitates relying on one or more conductive features in theinterconnect structure to couple the emitter region 36 with thecollector region 38.

The methods as described above are used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (e.g., as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case, the chip is mounted in a single chip package (e.g., aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (e.g., a ceramic carrierthat has either or both surface interconnections or buriedinterconnections). In any case, the chip may be integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either an intermediate product or an end product.

References herein to terms such as “vertical”, “horizontal”, “lateral”,etc. are made by way of example, and not by way of limitation, toestablish a frame of reference. Terms such as “horizontal” and “lateral”refer to a direction in a plane parallel to a top surface of asemiconductor substrate, regardless of its actual three-dimensionalspatial orientation. Terms such as “vertical” and “normal” refer to adirection perpendicular to the “horizontal” and “lateral” direction.Terms such as “above” and “below” indicate positioning of elements orstructures relative to each other and/or to the top surface of thesemiconductor substrate as opposed to relative elevation.

A feature “connected” or “coupled” to or with another element may bedirectly connected or coupled to the other element or, instead, one ormore intervening elements may be present. A feature may be “directlyconnected” or “directly coupled” to another element if interveningelements are absent. A feature may be “indirectly connected” or“indirectly coupled” to another element if at least one interveningelement is present.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. A method of fabricating a structure using adevice layer of a silicon-on-insulator substrate, the method comprising:forming a first emitter of a first heterojunction bipolar transistor anda second collector of a second heterojunction bipolar transistor in thedevice layer; epitaxially growing a first base layer of the firstheterojunction bipolar transistor on the device layer with an intrinsicbase portion arranged on the first emitter; epitaxially growing a firstcollector of the first heterojunction bipolar transistor on theintrinsic base portion of the first base layer; epitaxially growing asecond base layer of the second heterojunction bipolar transistor on thedevice layer with an intrinsic base portion arranged on the secondcollector; epitaxially growing a second emitter of the secondheterojunction bipolar transistor on the intrinsic base portion of thesecond base layer; and forming a connection between the first emitterand the second collector.
 2. The method of claim 1 wherein the firstbase layer is composed of silicon-germanium epitaxially grown with afirst profile of germanium content, and the second base layer iscomposed of silicon-germanium epitaxially grown with a second profile ofgermanium content that is equal to the first profile of germaniumcontent.
 3. The method of claim 1 wherein forming the connection betweenthe second emitter and the first collector comprises: forming a dopedregion in the device layer, wherein the doped region is arranged in thedevice layer to couple the first emitter with the second collector. 4.The method of claim 3 wherein forming the connection between the firstemitter and the second collector further comprises: siliciding at leasta section of the doped region between the first emitter and the secondcollector.
 5. The method of claim 1 further comprising: forming adielectric isolation region that penetrates through the device layer andthat is arranged between the first emitter and the second collector. 6.The method of claim 5 wherein forming the connection between the firstemitter and the second collector further comprises: forming aninterconnect structure that includes one or more conductive featuresconnecting the first emitter with the second collector.
 7. The method ofclaim 1 further comprising: implanting the device layer to form a firstdoped region and a second doped region separated by a spacing equal to adimension of the first emitter or to a dimension of the secondcollector.
 8. The method of claim 7 wherein the second doped region isarranged in the device layer to couple the first emitter with the secondcollector.
 9. The method of claim 1 further comprising: depositing aplurality of non-conductor layers on the device layer; and forming afirst opening in the non-conductor layers that is aligned with the firstemitter, wherein the first base layer and the first collector areepitaxially grown inside the first opening.
 10. The method of claim 9further comprising: forming a second opening in the non-conductor layersthat is aligned with the second collector, wherein the second base layerand the second emitter are epitaxially grown inside the second opening.